What the 87900-418HLF is
The Amphenol FCI BERGSTIK II 87900-418HLF is a dual-row 0.100-inch (2.54 mm) pitch board-to-board header in the 87900 series — 18 positions, all loaded, male pin through-hole mount with push-pull fastening. Contacts are phosphor bronze with 100 µin (2.54 µm) of tin on both the mating face and the solder post, rated 5 A per circuit at up to 110 V. The insulation body is black LCP-rated UL94 V-0, with an insulation height of 0.100 inch (2.54 mm) matching the pitch so the mated pair sits flush in the z-axis.
Where this connector fits
Board-to-board headers at 0.100-inch (2.54 mm) pitch are the standard parallel-mating signal/power bus for dense logic-level interconnects — backplane daughter cards, sensor arrays, and industrial control modules. The unshrouded header allows visual pin-count confirmation at assembly and mates with any standard dual-row BERGSTIK II or compatible IDC receptacle in the same pitch class.
Lifecycle and sourcing posture
The 87900-418HLF is listed Active — quoted to order against BOM quantity through the distributor channel. The 87900 base product number defines the series footprint; confirm the 18-position circuit count matches the board before committing. No official successor order code appears for this member.
Mating half and termination
The unshrouded male header mates with any standard dual-row 0.100-inch pitch receptacle housing or IDC socket in the BERGSTIK II series or compatible equivalents. Termination is through-hole solder — the 0.120-inch (3.05 mm) post length provides adequate fillet height for wave or hand-solder operations. The push-pull fastening is the primary retention; in high-vibration environments confirm the receptacle side carries a complementary friction-lock or latch feature to prevent unintended unmating.