What it is
The Amphenol FCI 87900-424HLF is the 24-position member of the BERGSTIK II board-to-board header series — a dual-row, unshrouded male pin header with push-pull fastening designed for through-hole solder assembly into a PCB. The 0.100" (2.54mm) pitch and 0.100" row spacing give it a standard 2-row footprint compatible with the broader BERGSTIK II ecosystem. Contacts are phosphor bronze with 100 µin (2.54 µm) tin plating on both the mating face and the solder-post side — a through-and-through tin finish suited for multiple thermal cycles during board assembly and field mating.
Selection parameters
The 5 A per contact rating at 110 V suits signal-duty and light power board-to-board paths — indicator circuits, logic-level power, or low-current control lines. All 24 positions are loaded. The 0.100" insulation height matches the pin pitch and row spacing, so the mated stack height is governed by the mating receptacle housing depth; confirm the board-to-board z-clearance against the target assembly before committing.
Mating half and termination
The 87900-424HLF is a male pin header — it requires a matching dual-row BERGSTIK II receptacle housing with IDC or crimp terminations for wire-to-board assemblies, or a board-mount receptacle header for stacked board-to-board configurations. The square pin cross-section seats into the corresponding slot in the mating housing; verify the housing keying configuration since the header itself is unshrouded. Solder-post tail length is 0.120" (3.05 mm) and overall contact length is 0.940" (23.88 mm) — sufficient for standard FR4 board thicknesses, but confirm pad size and hole diameter against the target PCB stack-up.
Sourcing posture
The 87900-424HLF is listed Active — sourced to order against the BOM quantity via RFQ. No official successor or cross-reference is on record; confirm the BERGSTIK II position count and pitch match the existing BOM line before committing. Packaging is bulk bag.