What This Header Is
The Amphenol FCI 87900-430HLF is the 30-circuit member of the BERGSTIK II dual-row header series. It is a board-to-board interconnect with 0.100 inch (2.54 mm) pitch throughout, built around square pin contacts in a push-pull push-pull mating interface. The contacts are phosphor bronze with tin plating at 100.0 µin (2.54 µm) on both the mating interface and the solder post, terminated through-hole. The black polyester insulator carries a UL94 V-0 flammability rating.
Ratings That Drive the Selection
The insulation height of 0.100 inch (2.54 mm) governs the board stack spacing when this header is used as a board-to-board stacking connector. The 0.120 inch (3.05 mm) post length and 0.720 inch (18.29 mm) mating length are through-hole dimensions; confirm your board thickness and hole depth before committing the footprint.
What the Design Engineer Needs to Verify
Because this is an unshrouded header, alignment during mating relies on the housing or receptacle guiding the pins — there is no shrouded keying to prevent mis-mate. Verify the mating half's keying and the board-side alignment features before specifying. All 30 positions are loaded (no reduced-position variants of this exact code), so confirm the circuit count matches your BOM line exactly. The push-pull push-pull fastening type means the pair mates and unmates without hardware — no jack-screws, latches, or screws to secure it in place. This suits applications where frequent access is required, but if your environment includes vibration, confirm the mating half provides sufficient retention without a secondary locking feature.