Product Overview
The Amphenol ICC (FCI) BERGSTIK II 87900-434HLF is a 34-position, dual-row board-to-board header with square pin contacts on 0.100" (2.54 mm) centres. Tin plating on both the mating interface and the solder-tail post runs 100 µin (2.54 µm) thick, giving durable wipe resistance for repeated mating cycles and robust through-hole solder joint integrity. Rated 5 A per circuit at 110 V, it handles signal and mixed-duty paths in compact stack-ups without crowding the board z-height — the insulator sits 0.100" proud of the board surface, matching the pitch grid cleanly. The dual-row layout spaces the 34 circuits across two rows at 0.100" row pitch, with all positions loaded. Push-pull fastening keeps the header seated during vibration without external hardware; the square pin geometry locks into the matching IDC or receptable housing without twist. Black UL94 V-0 insulation meets the flammability floor for most industrial and telecom backplane assemblies.
Where it fits in the BOM
The 34-position count is the primary BOM-line variable within the 87900 base family on a 0.100" pitch grid. BERGSTIK II is a standard-profile series with multiple second-source equivalents, so a single-vendor lock is not forced by the design.
Lifecycle and Sourcing
87900-434HLF is listed Active — quoted to order against the BOM quantity, no official last-time-buy or successor on record. The BERGSTIK II series carries wide second-source availability, which means a proven alternate drops in if lead times stretch on the primary build. Confirm the mating half and board footprint against the assembly drawing before committing to the full BOM run.