The Amphenol ICC BERGSTIK II 87900-444HLF is a 44-position, dual-row male header in the 0.100 inch (2.54 mm) pitch BERGSTIK II series — a board-to-board interconnect family built around square-pin through-hole geometry. The push-pull fastening means the header relies on contact normal force rather than a locking latch, so the unshrouded design and all-tin plating define the reconnection duty for field and production use.
Ratings that drive the fit decision
Pitch and row spacing are both 0.100 inch (2.54 mm) — the standard 2-row stack that matches the BERGSTIK II footprint, but verify that your board pad pattern and slot clearance accommodate the 0.100 inch row spacing before committing, since routing density inside the header zone is tight with 44 positions in two rows. The 110 V rating is the limiting spec here. The tin finish is adequate for signal and low-current power at that voltage, but the contact finish grade and current rating together tell you this is not a high-voltage design; the insulation colour (black) and UL94 V-0 rating confirm the housing material can handle the thermal environment of through-hole soldering without deforming. The 0.720 inch (18.29 mm) mating contact length and 0.120 inch (3.05 mm) tail give a full 0.940 inch (23.88 mm) overall contact length — the extended pin provides good wipe depth for a secure board-to-board mate, and the 0.100 inch (2.54 mm) insulation height sets the stacked board separation when mated into the matching receptacle.
Packaging and sourcing context
Shipped in bag packaging rather than tape-and-reel — which means this part is oriented for manual or tray-loaded placement, not high-speed SMT reel feeding. For a high-volume build the procurement team should confirm the assembly line can accommodate bag-quantity kitting or whether a tape-and-reel variant of the same BERGSTIK II base number exists for automated placement.