The Amphenol FCI 87900-454HLF is a 54-position, dual-row BERGSTIK II board-to-board header operating at 0.100" (2.54mm) pitch. With square male pins rated 5 A per circuit at 110 V and full tin plating on both the mating interface and the solder-post side, it fills a standard industrial signal/power interconnect role where a through-hole press-fit or wave-soldered board-stack is the target assembly method. The push-pull fastening type and unshrouded geometry leave the row edges open — this header mates with any matching dual-row BERGSTIK II receptacle housing in the same pitch and row-spacing, and the 0.100" row spacing keeps the footprint compatible with standard 0.100" pitch IDC and machine-wrap receptacles used across industrial controls and instrumentation.
The tin-on-tin contact system carries 100.0 µin (2.54 µm) of tin on the mating surface per and. This full-thickness deposit resists whisker growth and preserves contact resistance across the connector's lifecycle. Phosphor bronze contact material provides the spring compliance needed to maintain normal force through the square-pin interface. UL94 V-0 flammability on the housing material is the stated fire-resistance rating — relevant for industrial enclosures and any application where the board assembly sits near operator-accessible areas or enclosed spaces with limited airflow.
The 87900-454HLF carries an Active lifecycle status under base product number 87900 per and. No official successor or cross-reference MPN is listed for this specific 54-position variant. Confirm the position count and the dual-tin plating grade against the BOM line before committing — if your application requires gold-on-mating contacts, the same BERGSTIK II series offers alternative plating options under different base numbers per, and.