Product Introduction
The Amphenol FCI 87900-462HLF is the 62-circuit member of the BERGSTIK II dual-row header series, configured with 0.100-inch (2.54 mm) pitch throughout and 0.100-inch row spacing — the standard 2.54 mm grid that fits the majority of board-to-board mezzanine and passive backplane interconnects. Through-hole solder termination with square male pins accepts a standard 0.100-inch grid footprint; the push-pull fastening type provides friction retention typical of unshrouded dual-row headers used in card-edge and passive backplane assemblies. Tin plating on both the mating interface and the solder-post side gives 100 µin (2.54 µm) thickness — the series-typical finish grade for this position count, rated 5 A per circuit at 110 V and UL94 V-0.