The Amphenol FCI 87901-130HLF is the 30-circuit member of the BERGSTIK II dual-row pin header family — a board-to-board interconnect rated 5 A per circuit at 0.100" (2.54 mm) pitch. Gold or Gold GXT contact plating at 30 µin (0.76 µm) thickness over phosphor bronze gives the mating interface the durability for repeated engagement cycles, and the push-pull header body is UL94 V-0 rated for industrial equipment housings. All 30 positions are loaded — no partial-load option on this variant — and the through-hole square-pin body lands directly on the PCB for straightforward board-stacking in instrumentation, automation, and comms hardware.
Fit and termination
Unshrouded dual-row male pin, 0.100" row spacing, 0.100" pitch — mates with the matching BERGSTIK II IDC or crimp-style receptacle housing. Termination is through-hole solder; the 0.120" (3.05 mm) post extends below the insulator shoulder to meet the plated-through hole. The 1.040" (26.42 mm) overall length and 0.820" (20.83 mm) mating length define the board stack envelope and the acceptable z-height budget for the paired receptacle.
Ratings at a glance
110 V rating is the ceiling for signal and low-level power board-to-board routing — not suited for mains-adjacent or high-voltage backplane duty. The 5 A per-contact rating governs wire-gauge and trace-width derating on the mating half; the insulation height of 0.100" (2.54 mm) sets the standoff from the board surface for the full board-stacking height calculation.