What this connector is
The Amphenol FCI 93690-101-72LF is the 72-circuit member of the BERGSTIK® board-to-board header series — an unshrouded, dual-row breakaway header with 0.100" (2.54 mm) pitch throughout, supporting both press-fit and solder through-hole termination. The dual-plating stack puts 30.0 µin (0.76 µm) gold GXT on the mating face and 39.4 µin (1.00 µm) tin on the press-fit/post tail, so the interface gets the durability and low-contact-resistance benefit of gold while the board side stays solder-wettable or press-fit compliant without a separate plating process. Rated 5 A per contact at the mating interface, 110 V between adjacent circuits, and built in black UL94 V-0 thermoplastic, it is positioned for board-to-board stacking and board-to-cable breakaway routing in industrial control, instrumentation, and mid-volume assembly environments where the header ships loose in a bag for hand or selective placement.
What drives the fit decision
Packaging and line-feed reality
This part ships in a bag — a loose-pack format. For high-volume assembly the CM sourcing desk needs to know whether the EMS accepts loose-pack or requires tape-and-reel. No reel option appears in this spec entry. The press-fit option gives mechanical-interference retention on the board side — useful in high-vibration industrial applications where solder alone is a concern.
Lifecycle and sourcing posture
The 93690-101-72LF is listed Active — the procurement buyer can commit it to the BOM against a standard RFQ without an NRND or LTB flag in this entry. No official successor or cross-reference appears in the ledger for this position count, so the sourcing desk should confirm the AVL — one-source connectors in high-mix builds are a supply-risk, and the CM sourcing specialist will want to know whether an approved alternate exists in the same series before the build is released. Quote to order against BOM quantity.