The Amphenol ICC BERGSTIK 93690-103-20LF is a 20-position dual-row 0.100 inch (2.54 mm) pitch breakaway header in the BERGSTIK series. Designed for board-to-board or cable interconnects, it mounts through-hole with a combined press-fit and solder tail termination. The mating interface carries 30.0 µin (0.76 µm) Gold GXT plating for durability across reconnect cycles, while the solder tails are tin-plated at 39.4 µin (1.00 µm) to survive wave or hand-solder assembly. Rated 5 A per contact at up to 110 V, the dual-beam male pin array sits in a black UL94 V-0 thermoplastic housing with 0.100 inch (2.54 mm) insulation height — a standard footprint that fits the same routing grid as 0.100 inch pitch IDC headers and receptacles across the board.
What the ratings mean for your BOM fit
The 5 A per contact rating handles signal and moderate power buses; the limiting factor is the connector class, not the current density of the copper alloy contact material. Gold GXT plating on the mating interface (30.0 µin) outperforms standard tin for repeated reconnects in field service or test-fixture cycling. The 110 V rating is conservative for signal-level logic and low-voltage power distribution; it is not a high-voltage connector. The push-pull fastening type indicates friction retention — no screw-lock or latch, so the pair relies on normal insertion force to stay mated. For vibration-heavy environments pair this header with a receptacle that has a positive latch or use a board-mount guide to prevent backing out.