What This Header Is
The 93690-103-24LF is a BERGSTIK® dual-row breakaway header built for board-to-board or cable interconnect at 0.100-inch (2.54 mm) pitch. With 24 positions across two rows, it carries 5 A per circuit at 110 V — a solid rating for signal and low-power distribution in dense board assemblies. The contact split is notable: gold GXT™ at 30.0 µin (0.76 µm) on the mating face delivers durability under repeated engagement, while the post side is tin-plated at 39.4 µin (1.00 µm) to accommodate both solder and press-fit termination into the PCB hole.
Board Fit and Stack Geometry
Through-hole mounting with 0.177-inch (4.50 mm) post length and 0.100-inch (2.54 mm) insulation height aligns with the standard 2.54 mm board-stack vocabulary. The 0.100-inch row spacing matches standard 2.54 mm grid routing; the square pin shape accepts a range of IDC and discrete-wire terminations in the cable half of a board-to-cable run. Push-pull fastening without full shrouding means alignment in the field is manual — a factor in high-vibration panel environments where a shrouded lock would be preferred.
Selection Decision: Gold on Mating, Tin on Post
Typical Environments and Applications
Board-to-board signal distribution and low-power bussing in instrumentation, industrial control cards, and communications backplanes — the UL94 V-0 thermoplastic housing clears the flammability bar for enclosed equipment enclosures. The unshrouded breakaway design means it works as a test point or prototyping header as much as a production interconnect. The black housing and push-pull fastening are fine for lab and bench environments; for high-vibration production floors the lack of a locking shroud is the limiting factor.