Plating strategy and what it means for the application
The 93690-105-60LF uses a split plating approach. The mating interface carries gold GXT contact finish at 30.0 µin (0.76 µm), which gives lower contact resistance at first mate and better fretting resistance than tin alone — important if the header will see field-service re-mating. The solder-tail side is tin-plated at 39.4 µin (1.00 µm), optimised for solderability and wetting. The contact material is copper alloy throughout. At 5 A per contact the gold-on-mating / tin-on-post combination handles signal and lower-power bus duties without issue. The 110 V rating covers most low-voltage logic and control bus applications on the board stack.
Termination and mounting
The 93690-105-60LF terminates via through-hole with two modes accepted: press-fit or solder. The push-pull fastening type means the header seats and retains without tooling — a practical advantage in hand-assembly or proto builds. Post length is 0.177" (4.50 mm) from the board face, and overall contact length is 0.608" (15.44 mm). The insulation height matches the 0.100" (2.54 mm) row pitch, so the mated stack sits flat across the board plane. The housing is black thermoplastic rated UL94 V-0 — suitable for equipment where flame-retardant materials are required for safety compliance. Square contact pins provide rotational stability in the housing bore and resist twist-out under vibration stress. As an unshrouded breakaway header the 93690-105-60LF can be broken to a smaller position count in the field, which is useful when the exact circuit count is not locked at BOM entry. Mates with the matching BERGSTIK dual-row receptacle housing in the same pitch.