What This Connector Is
The Amphenol BERGSTIK® 93690-106-50LF is a 50-position, 2-row breakaway header rated for board-to-board or cable interconnect. The 0.100" (2.54mm) pitch and dual-row layout give it a 25-circuit-per-row density that fits standard 0.1-inch grid routing — the connector a BOM line calls for when the circuit count lands in the mid-range for this pitch class. All 50 positions are fully loaded, so there is no partial-Load option to negotiate with the manufacturer. The series name is BERGSTIK® — a dual-row pin header family from Amphenol built on the 0.1-inch grid. The base product number 93690 anchors this member to that series.
Key Ratings That Drive the Fit Decision
Pitch is 0.100" (2.54mm) on both the row spacing and the contact-to-contact mating axis — standard board-to-board grid, so the footprint lands on 0.1-inch routed channels with no special fan-out. Row spacing matches the contact pitch, meaning the two rows are stacked at the same 0.1" interval as the pins themselves. Current rating is 5 A per contact at the stated voltage of 110 V. For a 0.1" pitch header the 5 A per circuit is the practical ceiling — the pitch itself limits current density more than the contact material does. If the design runs multiple circuits at sustained power, check the derating curve against your worst-case board temperature; the housing material (thermoplastic, UL94 V-0) sets the rise limit. Contact finish splits across the connector: gold GXT™ at 30.0 µin (0.76 µm) on the mating interface, tin at 39.4 µin (1.00 µm) on the post/solder tail. The gold on the mating side means the connector is designed for repeat mating cycles — the precious-metal plating resists fretting and surface degradation across reconnections in a way that tin-only finishes cannot guarantee. The tin post is optimised for solder-wetability and board attachment, not for the mating interface itself. Termination is dual-style: press-fit and solder, through-hole mount. The press-fit option allows the header to be driven into plated-through holes without solder for a press-fit assembly flow, while the solder specification confirms it can also be wave- or hand-soldered conventionally. Fastening type is listed as push-pull, which on a breakaway header means the contacts engage and disengage with a straightforward axial push-pull action — no latch, no locking feature, which is consistent with an unshrouded header that relies on the socket's retention to hold the mated pair. Insulation height is 0.100" (2.54mm) — the header stands 2.54mm proud of the board surface after soldering, which matters for the mated stack height in board-to-board applications. The insulation material is thermoplastic rated UL94 V-0, so the connector meets the flammability floor for industrial and commercial equipment enclosures.
Where It Goes
The board-to-board or cable style places this header in mid-density signal or low-level power interconnects inside equipment — industrial control cards, instrumentation backplanes, and cable-to-board harness junctions where a 50-circuit run needs a reliable, repeatable mate. The unshrouded design means the header is open on all four sides; alignment and polarisation are handled entirely by the socket housing. If the application needs keyed polarisation, the mating half must carry the shroud or keying feature — this header alone does not provide it.