Ratings that drive the BOM decision
The 93939-426HLF: 26 positions across two rows at 0.100-inch pitch places this header in the mid-density range for board-to-board applications — suited for card-edge interconnects, parallel-stacking daughter cards, and industrial I/O modules where the daughter card carries 26 or fewer signals. The 5 A per contact rating at 110 V covers low-level signal and moderate power paths on the same connector — the tin-plated contacts (2.54 µm thickness on the mating face) are durable for multiple mate cycles, making this a reasonable choice for field-serviceable board pairs where the daughter card is expected to be removed and re-seated. The 0.160-inch mated post length and 0.190-inch insulation height govern how far the header standoff protrudes above the board surface and how deep it penetrates the receptacle — both dimensions matter when the board stack z-height is constrained or when routing traces beneath the header footprint. UL94 V-0 flammability rating on the black housing means the connector meets the minimum material fire-retardance required in most industrial and instrumentation enclosures — no additional flame barrier needed for compliance at the connector itself.
Mounting, retention, and what it mates with
Right-angle through-hole mount with a 0.120-inch post length beyond the board — the solder tail footprint follows the standard 0.100-inch grid, compatible with wave or hand-solder processes. Push-pull fastening is the standard BERGSTIK II retention mode — the header self-retains in the receptacle via a friction fit; no additional locking clip is specified for this member, so verify that your application does not require positive latch assurance beyond push-pull. The header is unshrouded — the contact rows are exposed on the mating face. This is typical for the BERGSTIK II series and works well when the receptacle housing provides shrouding at the system level, or when board-alignment features hold the pair in register during mating.