What This Header Is
The Amphenol FCI 95687-124HLF is the 24-circuit member of the BERGSTIK II unshrouded header series, a standard-density 0.100-inch (2.54 mm) pitch family used as a board-to-board interconnect in industrial control, instrumentation, and communications equipment. The connector carries 5 A per contact at 110 V across 24 gold-plated phosphor bronze contacts arranged in two rows, all fully loaded. The push-pull fastening type and square-pin contact geometry mate with the matching BERGSTIK II receptacle housing or any IDC-style header sharing the same 0.100-inch footprint. The 0.100-inch insulation height of 0.100" (2.54 mm) defines the mated stack height when paired with the mating housing; the 0.360" (9.14 mm) post length reaches through the PCB for wave-solder termination. Contact finish is gold or Gold GXT at 30.0 µin (0.76 µm) on the mating face.
How the Ratings Drive the Fit
24 positions at dual-row 0.100" pitch is the primary BOM match — the circuit count locks the footprint and the 0.100" row spacing confirms routing compatibility with any BERGSTIK II sibling at the same density. All 24 circuits are loaded, so there are no partially-populated positions to account for. The 5 A per-contact rating handles both signal and low-level power bus at this position count; the 110 V ceiling exceeds control-level operating voltage. The gold or Gold GXT plating at 30.0 µin (0.76 µm) exceeds tin-grade durability for extended mating cycle life. Push-pull fastening and unshrouded geometry mean this header does not use a polarizing rib — keying relies entirely on the mating housing. The through-hole mount with 0.360" (9.14 mm) post length suits standard board thickness for wave solder. The UL94 V-0 flammability rating on the housing material satisfies the ignition-resistance requirement in most industrial and telecom equipment enclosures.
Where It Is Used
Sourcing and Lifecycle
The 95687-124HLF is listed Active with no stated last-time-buy or NRND notice. Quoted to order against BOM quantity — no broker-channel or allocation pressure on record. No official successor order code is listed in the lifecycle record.