What the 95687-142HLF is and where it sits in the BERGSTIK® II series
The Amphenol FCI 95687-142HLF is a 42-position dual-row board-to-board header in the BERGSTIK® II series — a family of 0.100-inch (2.54 mm) pitch square-pin headers designed for through-hole solder mounting in industrial and instrumentation applications. All 42 positions are loaded with male pins that mate with the matching BERGSTIK® II receptacle housing or IDC connector. The dual-row layout distributes the 42 circuits across two rows at 0.100-inch row spacing, giving a centreline-to-centreline row pitch that matches standard 0.100-inch grid routing on the board. With phosphor bronze contacts plated 30.0 µin (0.76 µm) gold or Gold GXT™ on the mating surface, the 5 A per-circuit current rating handles signal and moderate-power distribution duty — the gold plating grade is the selection driver, not the tin-plating alternative found in lower-cycle siblings of the same series. The push-pull fastening type relies on header pin-to-receptacle contact geometry rather than a separate locking latch, so the mated assembly depends on normal mating tolerance rather than an active lock. The housing is rated UL94 V-0.
Board layout fit — 42 positions at 0.100-inch pitch
The 42-position dual-row layout distributes all 42 circuits across two rows at 0.100-inch row spacing — this matches standard two-lane grid routing on industrial control cards and instrumentation backplanes. The contact length of 0.360 inch (9.14 mm) below the insulation shoulder establishes the board-to-board stack height contribution when mated with a corresponding receptacle: add the receptacle pin depth to calculate the total board-spacing budget. The 0.100-inch insulation height matches the board pitch, so the header sits flush with the board surface without a protruding shoulder that would affect adjacent component placement. Through-hole mounting with square pin termination provides mechanical lead-in during insertion and a defined solder fillet on the pad — the square pin shape is not a retention feature but aids visual inspection of the solder joint.
Mating half and termination expectations
The 95687-142HLF mates with the matching BERGSTIK® II dual-row receptacle housing — typically an IDC or crimp-based housing accepting discrete wires on the wire side. The push-pull fastening type means the header pins engage the receptacle contacts with interference-fit geometry; there is no separate locking clip on the header itself, so the engineer relying on a positive retention feature must confirm the receptacle housing carries a primary latch or TPA (Terminal Position Assurance) mechanism. The square pin cross-section seats in a corresponding square or rectangular contact slot in the receptacle. Solder termination is through-hole — the board must have plated-through holes sized for the square pin cross-section, which is typically slightly smaller than the hole diameter to allow insertion without excess clearance that would degrade solder joint reliability.