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10005639-11103 — Amphenol product photo
Amphenol

10005639-11103 DDR2 DIMM Connector, 240-Pin

MPN10005639-11103
Active

Amphenol ICC (FCI) 10005639-11103, 240-position DDR2 DIMM connector, through-hole mount, 30.0µin gold contact finish, board lock and latches, tray package.

$2.1141Ref. price · indicative, final on quote
10005639-11103 datasheet
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
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Specifications

10005639-11103 Technical Specifications
ParameterValue
Memory typeDDR2 SDRAM
Mounting typeThrough Hole
Mounting featureNormal, Standard - Top
Connector typeDIMM
StandardsMO-237
PackageTray
FeaturesBoard Lock, Latches
Contact finishGold
Positions240
Contact finish thickness30.0µin (0.76µm)

Product details

DDR2 DIMM Connector — 240-Position, Through-Hole, Gold Contacts

The 10005639-11103 is a 240-position DIMM connector from Amphenol ICC (FCI), designed specifically for DDR2 SDRAM modules. The 240 circuit count and compliance with the MO-237 standard ensure mechanical and electrical compatibility with standard DDR2 DIMM slots. Mounting is through-hole with a standard-top orientation — the connector body sits perpendicular to the board, and the mounting feature aligns the slot for normal DIMM insertion. Through-hole termination gives a robust solder joint compared to SMT, important for connectors that see repeated module swaps.

Submit an RFQ for current lead time and per-unit pricing against your BOM quantity.

Frequently asked questions

Is the 10005639-11103 compatible with DDR2 SDRAM?

Yes, the 10005639-11103 is a 240-position DIMM connector designed for DDR2 SDRAM, compliant with the MO-237 standard.

Does the 10005639-11103 include board locks and latches?

Yes, board locks and latches are included as standard features for mechanical retention and secure module mating.