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10082202-101-20LF — Amphenol product photo

Amphenol BERGSTIK 10082202-101-20LF Header, 20 Pos, 2.54mm

MPN10082202-101-20LF
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Amphenol ICC (FCI) BERGSTIK® header, order code 10082202-101-20LF, 20 positions, dual row, 0.100" (2.54mm) pitch, 3A per contact, gold or gold GXT™ mating contacts, through-hole right-angle, solder termination.

$1.2500Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

10082202-101-20LF Technical Specifications
ParameterValue
SeriesBERGSTIK®
GenderMale Pin
Mounting typeThrough Hole, Right Angle
Connector typeHeader, Breakaway
Fastening typePush-Pull
Current rating3A per Contact
Operating temperature-65°C~130°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.190\" (4.83mm)
Insulation materialThermoplastic
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions20
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact length - post0.098\" (2.50mm)
Contact finish - matingGold or Gold, GXT™
Contact length - mating0.230\" (5.84mm)
Contact finish thickness - post78.7µin (2.00µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

20-pin breakaway header, dual-row 0.100" pitch

The 10082202-101-20LF is the 20-position member of the Amphenol ICC (FCI) BERGSTIK® breakaway header line, a dual-row unshrouded board-to-board interconnect. Mating contacts are gold or gold GXT™ plated to 30.0µin (0.76µm) over phosphor bronze; the solder tails are tin-plated 78.7µin (2.00µm). Rated 3A per contact with a UL94 V-0 thermoplastic housing.