Amphenol 10119109-508022LF Header 8-Pos 0.100" Pitch
MPN10119109-508022LF
Active
Amphenol ICC BERGSTIK II 8-position dual-row unshrouded header, 0.100 inch (2.54 mm) pitch, through-hole solder termination with square male pins. Gold-plated mating interface, 30.0 µin (0.76 µm) thick; insulation height 0.100 inch; push-pull fastening; UL94 V-0 rated housing.
$0.7169Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Jul 2026
Specifications
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bag |
| Shrouding | Unshrouded |
All specifications
| Parameter | Value |
|---|---|
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 8 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact length - post | 0.120\" (3.05mm) |
| Overall contact length | 0.450\" (11.43mm) |
| Contact finish - mating | Gold |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
Frequently asked questions
What connector style is the 10119109-508022LF listed as?
The listed style is Board to Board — the connector is a through-hole header intended for board-to-board stacking or cable-to-board interface via a mating receptacle.
What series does the 10119109-508022LF belong to?
The part is in the BERGSTIK II series from Amphenol ICC, with base product number 10119109 — the 508022LF suffix identifies the 8-position configuration with gold-plated contacts in a bag package.