Board-to-Board Header for 26-Position Signal Interconnects
The 77311-122-26LF: The solder posts are tin-plated (78.7 µinch / 2.00 µm) for reliable soldering into through-hole boards. Current rating is 3 A per contact, typical for signal-level interconnects in this pitch class.
In vibration-prone environments, a secondary retention method (e.g., glue or a locking receptacle) should be considered.
It is bag-packaged and available through independent distribution channels.
