Amphenol ICC (FCI) BERGSTIK® series, 77313-126-10LF, unshrouded breakaway header, 10 positions, dual-row, 0.100" (2.54mm) pitch, through-hole solder termination, 30.0µin (0.76µm) gold mating finish, UL94 V-0 black thermoplastic housing.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board or Cable |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 10 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 77313-126-10LF: Dual-row 0.100-inch pitch, 10 positions loaded — the board footprint is a standard 2×5 grid with 0.100" row spacing. This is the same pitch as legacy DIP ICs and Berg strip receptacles, so the mating half is a common IDC socket or crimp housing that matches a 10-position dual-row layout. For vibration-prone environments, pair this with a receptacle that has its own locking latch — the header itself provides only push-pull retention.
Common mates include BergStik receptacle housings and ribbon-cable IDC connectors. The push-pull retention means the mating half should supply its own latch if vibration is a concern.
The mating pitch is 0.100" (2.54mm) between pin centers, with the same 0.100" row spacing. This is the industry-standard 0.100" grid, compatible with a wide range of breadboards and prototyping boards.