Amphenol ICC (FCI) BERGSTIK® series, unshrouded breakaway header, 10 positions, 0.100" (2.54mm) pitch, through-hole right-angle, male pin, gold or GXT™ mating contact finish, 3 A per contact.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Type | Male Pin |
| Mounting | Through Hole, Right Angle |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Current rating | 3A per Contact |
| Operating temperature | -65°C~125°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.094\" (2.40mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 10 |
| Contact finish - post | Tin |
| Contact length - post | 0.101\" (2.57mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.225\" (5.72mm) |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
The 77315-801-10LF: The mating contact carries a gold or GXT™ finish at 15.0 µinch (0.38µm) thickness over phosphor bronze.
The 0.225" (5.72mm) mating pin length and 0.094" (2.40mm) insulation height give a typical mated stack height around 0.319" (8.10mm) with a standard low-profile socket — confirm the socket's insulator height for your z-height budget.
The mating pitch is 0.100" (2.54mm), which is the standard spacing for this BERGSTIK® series breakaway header.
The part number suffix 'LF' indicates lead-free / RoHS-compliant termination finish, consistent with Amphenol ICC (FCI) RoHS program.
The BERGSTIK® series includes other 10-position, single-row, right-angle headers with the same 0.100" pitch — confirm the exact contact plating and pin length match your application.
Yes, its listed style is Board to Board. The unshrouded header mates with a standard 0.100" pitch socket strip, making it suitable for mezzanine or parallel-board stacking.