It uses the standard 0.100" (2.54 mm) pitch on both the mating interface and the row spacing, so it lands on a familiar grid for prototyping or production boards. Rated at 5 A per circuit, the current capacity is typical for a 0.100" pitch header — enough for signal-level loads and light power distribution, but not a main power rail. The mating contacts carry a gold or GXT finish at 30.0 µin (0.76 µm) thickness, which supports repeated mating cycles without the contact resistance drift you see with tin-on-tin interfaces.
The square pins measure 0.160" (4.06 mm) on the mating side and 0.120" (3.05 mm) on the solder tail. The right-angle through-hole termination requires the board to have a matching 2-row, 66-position through-hole pattern at 0.100" pitch. No secondary retention features; the friction of the pin-socket interface holds the mated pair.