Amphenol ICC (FCI) DILB16P-223TLF, 16-pin DIP socket, 0.100" (2.54 mm) pitch, 0.3" (7.62 mm) row spacing, through-hole solder termination, tin-plated contacts, UL94 V-0 nylon housing, 1 A rating.
| Parameter | Value |
|---|---|
| Type | DIP, 0.3\" (7.62mm) Row Spacing |
| Mounting type | Through Hole |
| Current rating | 1 A |
| Operating temperature | -55°C~105°C |
| Housing material | Polyamide (PA), Nylon |
| Contact material - post | Copper Alloy |
| Contact material - mating | Copper Alloy |
| Material flammability rating | UL94 V-0 |
| Package | Tube |
| Features | Open Frame |
| Termination | Solder |
| Pitch - post | 0.100\" (2.54mm) |
| Pitch | 0.100\" (2.54mm) |
| Contact resistance | 30mOhm |
| Contact finish - post | Tin |
| Contact finish - mating | Tin |
| Termination post length | 0.124\" (3.15mm) |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 100.0µin (2.54µm) |
| Number of positions or pins | 16 (2 x 8) |
The DILB16P-223TLF: The open-frame design allows airflow under the IC, which helps with thermal management in moderate-power applications.
The termination post length is 0.124" (3.15 mm), which fits standard 0.062" to 0.093" PCBs with enough protrusion for a reliable solder fillet. Contact resistance is 30 mΩ, typical for a tin-plated dual-beam contact in a DIP socket.
Yes. The open-frame socket accepts ICs with a body width up to 0.3" and pin rows on 0.3" centres.
Availability and current pricing confirmed at quote time.