CUI Devices TBL00 Wire To Board Headers Series

13 variants · CUI DevicesAll Wire-to-Board Headers →

About the CUI Devices TBL00 Wire To Board Headers Series

IC Source Direct is a China connector distributor, supplier and independent procurement agent for CUI Devices TBL00 Wire To Board Headers Series components, matching housing, contact and mating cycles across the Shenzhen interconnect channel. The CUI Devices TBL00 Wire To Board Headers Series series groups 13 related part numbers, each listed with full specifications, a datasheet where available, and an RFQ option. Every variant in the range shares a common housing material of Polyamide (PA66), Nylon 6/6, number of levels of 1 and operating temperature of -40°C ~ 105°C. Variants differ by clamp material - plating, color and contact material - plating, so you can match the exact clamp material - plating your application requires using the selection guide below. All listed CUI Devices TBL00 Wire To Board Headers Series part numbers are active and orderable.

Select a variant by

Clamp material - plating: - · Steel, Stainless
Color: Blue · Gray · Green
Contact material - plating: Copper Alloy - Tin Plated · Phosphor Bronze - Tin Plated
Current: 2 A · 10 A
Features: Interlocking (Side), Lever Actuated · Interlocking (Side), Push Button Actuated
Mating orientation: 45° (135°) Angle with Board · Horizontal with Board · Vertical with Board
Mounting: Through Hole · Through Hole, Kinked Pin
Pitch: 0.100\" (2.54mm) · 0.138\" (3.50mm) · 0.200\" (5.08mm)

Shared specifications

Housing material: Polyamide (PA66), Nylon 6/6
Number of levels: 1
Operating temperature: -40°C ~ 105°C
Package: Tray
Screw material - plating: -
Screw thread: -
Torque - screw: -

Variant comparison

Parameter	TBL002A-350-06GY-2GY	TBL003-254-03GR-2OR	TBL004-508-02BE-2GY	TBL004-508-03BE-2GY	TBL004-508-04BE-2GY	TBL004-508-05BE-2GY
Clamp material - plating	-	Steel, Stainless	-	-	-	-
Color	Gray	Green	Blue	Blue	Blue	Blue
Contact material - plating	Phosphor Bronze - Tin Plated	Copper Alloy - Tin Plated	Copper Alloy - Tin Plated	Copper Alloy - Tin Plated	Copper Alloy - Tin Plated	Copper Alloy - Tin Plated
Current	2 A	2 A	10 A	10 A	10 A	10 A
Features	Interlocking (Side), Push Button Actuated	Interlocking (Side), Lever Actuated	Interlocking (Side), Push Button Actuated	Interlocking (Side), Push Button Actuated	Interlocking (Side), Push Button Actuated	Interlocking (Side), Push Button Actuated
Mating orientation	45° (135°) Angle with Board	Horizontal with Board	Horizontal with Board	Horizontal with Board	Horizontal with Board	Horizontal with Board
Mounting	Through Hole, Kinked Pin	Through Hole	Through Hole	Through Hole	Through Hole	Through Hole
Pitch	0.138\" (3.50mm)	0.100\" (2.54mm)	0.200\" (5.08mm)	0.200\" (5.08mm)	0.200\" (5.08mm)	0.200\" (5.08mm)

Request a quote on any CUI Devices TBL00 Wire To Board Headers Series part number and we confirm price, availability and lead time per line — including end-of-life and allocation-constrained variants.