Hirose BM20 series header, outer shroud contacts, 50 positions, 0.40mm pitch, 2 rows, gold plating, 0.8mm stacking height, surface mount, solder retention.
| Parameter | Value |
|---|---|
| Series | BM20 |
| Mounting | Surface Mount |
| Connector type | Header, Outer Shroud Contacts |
| Height above board | 0.026\" (0.65mm) |
| Mated stacking heights | 0.8mm |
| Pitch | 0.016\" (0.40mm) |
| Package | Tape & Reel (TR) Cut Tape (CT) |
| Features | Solder Retention |
| Contact finish | Gold |
| Rows | 2 |
| Positions | 50 |
| Contact finish thickness | 2.00µin (0.051µm) |
The Hirose BM20B(0.8)-50DP-0.4V(51) is a 50-position header with outer shroud contacts from the BM20 series, designed for board-to-board mezzanine stacking at a mated height of 0.8mm. The 0.016" (0.40mm) pitch packs 50 circuits into a dual-row footprint that suits compact handheld and portable device PCBs where every millimeter of board real estate is allocated.
The 0.026" (0.65mm) height above board keeps the component profile low for tight enclosures.
Submit a request for quote to confirm current availability and pricing for your BOM quantity.
The mated stacking height is 0.8mm, which sets the z-axis clearance between the two PCBs in a mezzanine stack.