0.6mm Stacking Header for Dense Board-to-Board Interconnects
The Hirose BM23FR0.6-10DP-0.35V(895) is a 10-position header from the BM23 series, designed for ultra-low-profile board-to-board stacking. With a 0.014" (0.35mm) pitch and a mated stacking height of 0.6mm, this connector is built for space-constrained electronics where the z-axis clearance is measured in fractions of a millimeter.
Position Count and Board Fit
This 10-position member of the BM23 family sits between the 8-position BM23FR0.6-8DP-0.35V(895) and the 12-position BM23FR0.6-12DP-0.35V(895) at the same 0.014" (0.35mm) pitch and 0.6mm stacking height. The position count is the only variable — the footprint pitch and board layout pattern are identical across the series, so swapping to a different position count requires a PCB layout change to match the contact row length.
SMT Termination and Solder Retention
Tape & Reel packaging supports automated pick-and-place assembly.
