0.6mm Stacking Height, 0.35mm Pitch — Ultra-Low-Profile Board-to-Board Mezzanine
The Hirose BM23FR0.6-10DS-0.35V(895) is a 10-position receptacle from the BM23 series, designed for board-to-board mezzanine stacking where the vertical clearance is tight. The 0.014" (0.35mm) pitch and 0.024" (0.61mm) height above board let it fit into compact handheld or wearable device stacks. Mated stacking height is 0.6mm — that is the dimension that governs the board spacing, not the component height alone. The dual-row, center strip contact arrangement keeps the signal path short and the footprint narrow, which matters when routing dense traces between stacked PCBs.
10 Positions vs 12 — Position Count Is the Selection Gate
The BM23 series offers this same 0.35mm pitch and 0.6mm stack height in 8, 10, and 12 positions. The BM23FR0.6-10DS-0.35V(895) sits at 10 circuits — the BOM line match is the position count, not the footprint outline. The 12-position sibling (BM23FR0.6-12DS-0.35V(895)) shares the same pitch, height, and gold plating, so the footprint widens by two contact positions. If your design calls for 10 signal lines, this is the one; if you need 12, step up to the 12-position variant. No other functional difference between them — same series, same stack height, same termination.
Solder Retention and SMT — Board Assembly Fit
Surface mount termination with solder retention features built into the part. This is not a connector for repeated field disconnect; it is a permanent board-stacking joint.