Board-Stacking Header for Tight Z-Height Budgets
The Hirose BM23FR0.6-12DP-0.35V(895) is a 12-position header from the BM23 series, designed as a board-to-board mezzanine interconnect with a mated stack height of 0.6mm. The outer shroud contacts guide the mating receptacle and protect the pins during engagement, which matters when the connector is buried in a stack and you don't get a second look at the alignment.
At 12 positions, this header sits between the 10-position BM23FR0.6-10DP-0.35V(895) and the 16-position BM23FR0.6-16DP-0.35V(895) variants, all sharing the same 0.35mm pitch, 0.6mm stack height, and gold contact finish. The choice comes down to how many signal lines your board edge needs — 10, 12, or 16 — with no change in footprint density.
Surface Mount Assembly and Retention
The 0.020" (0.50mm) height above board keeps the profile low, and the gold contact finish at 1.97µin (0.050µm) provides a corrosion-resistant mating surface for the expected cycle life in a consumer or portable device. Tape & Reel packaging suits automated pick-and-place lines; Cut Tape is available for prototype or low-volume builds.