0.35mm Pitch, 0.6mm Stack — Tight-Density Mezzanine Receptacle
The BM23FR0.6-12DS-0.35V(895): The 0.014" (0.35mm) pitch and 0.024" (0.61mm) height above board let it fit into ultra-slim assemblies like smartphone modules, wearable PCBs, or compact camera stacks where every tenth of a millimeter is budgeted.
12 Positions vs 10 and 8 — Position Count Match
This 12-position receptacle sits between the 10-position BM23FR0.6-10DS-0.35V(895) and the 8-position BM23FR0.6-8DS-0.35V(895) in the same BM23FR0.6 base series. The footprint and keep-out zone scale with the contact count, so swapping between them requires a board respin, not just a BOM change. The 12-position variant matches a 12-circuit signal bus; the 10- or 8-position siblings are there if your I/O count is lower.
Active Lifecycle, Sourced to Order
It is RoHS compliant. No official second-source or direct cross-reference exists beyond the Hirose BM23 series itself.
SMT Termination with Solder Retention
Surface mount termination with solder retention features built into the body. The 0.35mm pitch requires a tight PCB footprint; verify the land pattern against the Hirose recommended layout before committing the board design.