The Hirose BM23FR0.6-16DP-0.35V(51) is a 16-position header from the BM23 series, designed for board-to-board stacking with an outer shroud contact arrangement. Its defining dimension is the 0.014" (0.35mm) pitch, which packs the 16 contacts into a compact dual-row footprint. The mated stacking height is 0.6mm, with the header sitting 0.020" (0.50mm) above the board — this is an ultra-low-profile interconnect for tight z-height budgets in portable electronics, wearables, or compact modules where every tenth of a millimeter counts.
The pitch drives the board layout
At 0.35mm pitch, this is a fine-pitch connector. The 2-row arrangement with 16 total positions means 8 contacts per row, and the outer shroud contacts wrap around the edges of the header body rather than being a conventional pin field. This contact geometry mates with the corresponding BM23 receptacle, which has contacts on the inner walls.
The header includes solder retention features — additional metal tabs on the body that solder to the board alongside the signal contacts. This prevents the connector from floating or tombstoning during reflow, and adds mechanical shear strength once soldered. Surface mount termination with these retention anchors suits automated pick-and-place assembly on a standard SMT line.
Cross-reference and packaging
The BM23FR0.6-16DP-0.35V(895) is electrically and mechanically identical to the (51) suffix version — same pitch, positions, height, and gold plating. For a BOM line, either suffix works; the (51) is the standard cut-tape variant for prototyping or low-volume builds.