Board-to-Board Stacking Header for Tight Z-Height Budgets
The BM23FR0.6-16DP-0.35V(895): The 0.6 mm mated stacking height is the defining dimension — this connector fits into the thinnest mezzanine gaps, common in compact handheld or portable device designs where every tenth of a millimeter counts. The 0.35 mm pitch on a dual-row layout packs 16 circuits into a narrow footprint, demanding careful trace routing on the PCB but enabling high-density interconnects in a small board area. Gold contact finish with 1.97 µin thickness provides reliable signal integrity for moderate mating cycles typical of internal board-to-board connections.
The BM23 series offers this 16-position variant alongside 12-position and 20-position siblings (BM23FR0.6-12DP-0.35V(895) and BM23FR0.6-20DP-0.35V(895)), all sharing the same 0.35 mm pitch, 0.6 mm stack height, and gold plating. The choice between them is purely a circuit-count decision — the footprint scales linearly with position count, so the board layout must match the exact number of signal lines required. There is no difference in current handling or mechanical envelope beyond the length of the connector body.