The Hirose BM23FR0.6-24DP-0.35V(51) is a 24-position header with outer shroud contacts from the BM23 series, built for board-to-board mezzanine stacking at a tight 0.6mm mated height. The 0.35mm pitch and dual-row layout pack 24 circuits into a footprint that suits compact portable electronics — think smartphone mainboards, wearable module interconnects, or any assembly where the z-height budget is measured in tenths of a millimeter. Gold-plated contacts with 1.97µin thickness handle signal-level current across repeated mating cycles without fretting.
The 0.6mm mated stacking height is the dimension that decides whether this header fits your board stack — it sets the gap between the two PCBs when mated with the matching BM23 receptacle.