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Hirose Electric Co Ltd BM23FR0.6-24DP-0.35V(895) — Mezzanine & Stacking Connectors

Hirose BM23FR0.6-24DP-0.35V(895) Header, 24 Pos

MPNBM23FR0.6-24DP-0.35V(895)
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Hirose BM23 series header, outer shroud contacts, 24 positions, 0.35mm pitch, dual-row, 0.6mm mated stack height, SMT, gold-plated contacts.

$1.0500Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

BM23FR0.6-24DP-0.35V(895) Technical Specifications
ParameterValue
SeriesBM23
MountingSurface Mount
Connector typeHeader, Outer Shroud Contacts
Height above board0.020\" (0.50mm)
Mated stacking heights0.6mm
Pitch0.014\" (0.35mm)
PackageTape & Reel (TR) Cut Tape (CT)
FeaturesSolder Retention
Contact finishGold
Rows2
Positions24
Contact finish thickness1.97µin (0.050µm)

Product details

0.6mm Stack Height — the tightest mezzanine gap in the BM23 line

The Hirose BM23FR0.6-24DP-0.35V(895) is a 24-position header from the BM23 series, designed for board-to-board mezzanine stacking at a mated height of 0.6mm. That 0.6mm gap is the defining dimension — it sets the clearance between parallel PCBs and drives the entire mechanical envelope of the assembly. The 0.35mm pitch and dual-row layout pack 24 circuits into a footprint that fits tight handheld or wearable device layouts.

The BM23FR0.6 header family shares the same 0.35mm pitch, 0.6mm stack height, and dual-row layout across position counts. The 24-position BM23FR0.6-24DP-0.35V(895) sits between the 20-position BM23FR0.6-20DP-0.35V(895) and the 30-position BM23FR0.6-30DP-0.35V(895). All three use the same PCB footprint pattern per position, so swapping between them changes only the board-edge length, not the per-contact layout.

SMT assembly and solder retention

At 0.35mm pitch, the stencil aperture and paste volume need tight control — this is not a hand-solderable part. The Tape & Reel packaging feeds pick-and-place lines directly.

Frequently asked questions

What is the mated stacking height of BM23FR0.6-24DP-0.35V(895)?

The mated stacking height is 0.6mm, with the header standing 0.020" (0.50mm) above the board surface before mating. That 0.6mm gap is the total board-to-board clearance when mated with the matching BM23 receptacle.

Where can I buy BM23FR0.6-24DP-0.35V(895)?

This part is sourced to order against your BOM quantity.