0.6mm Stack Height — the tightest mezzanine gap in the BM23 line
The Hirose BM23FR0.6-24DP-0.35V(895) is a 24-position header from the BM23 series, designed for board-to-board mezzanine stacking at a mated height of 0.6mm. That 0.6mm gap is the defining dimension — it sets the clearance between parallel PCBs and drives the entire mechanical envelope of the assembly. The 0.35mm pitch and dual-row layout pack 24 circuits into a footprint that fits tight handheld or wearable device layouts.
The BM23FR0.6 header family shares the same 0.35mm pitch, 0.6mm stack height, and dual-row layout across position counts. The 24-position BM23FR0.6-24DP-0.35V(895) sits between the 20-position BM23FR0.6-20DP-0.35V(895) and the 30-position BM23FR0.6-30DP-0.35V(895). All three use the same PCB footprint pattern per position, so swapping between them changes only the board-edge length, not the per-contact layout.
SMT assembly and solder retention
At 0.35mm pitch, the stencil aperture and paste volume need tight control — this is not a hand-solderable part. The Tape & Reel packaging feeds pick-and-place lines directly.
