Board-to-Board Interconnect for Tight Stack Heights
The Hirose BM23FR0.6-30DP-0.35V(895) is a 30-position header from the BM23 series, designed for board-to-board mezzanine stacking. It uses outer shroud contacts on a 0.35mm pitch and mates to a 0.6mm stack height — that gap is where the connection lives or dies, and at this pitch the board alignment has to be tight.
What the 0.35mm Pitch and 0.6mm Stack Height Mean for Your Layout
At 0.35mm pitch, the routing density is high — you are fitting 30 signals into a body roughly 5.25mm wide. The 0.6mm mated stack height is the total z-height between the two PCBs after mating, so the board-to-board gap is tight. The 0.50mm height above board on the header side means the component sits low, leaving the rest of the gap for the mating receptacle.