0.35mm Pitch, 30-Position Mezzanine Receptacle
The Hirose BM23FR0.6-30DS-0.35V(51) is a 30-position receptacle with center strip contacts from the BM23 series, designed for board-to-board mezzanine stacking. It uses a 0.014" (0.35mm) pitch across two rows, with a mated stacking height of 0.6mm and a height above board of 0.024" (0.61mm). It is typically used in compact handheld devices, wearables, and other space-constrained electronics where a low-profile, high-density interconnect is needed.
Position Count and Pitch — Fit for the BOM
The 0.35mm pitch is tight — board routing and pad design need to follow the recommended footprint to avoid shorts. Compared to the 24-position sibling BM23FR0.6-24DS-0.35V(895), this part adds six more contacts in the same footprint width, so the extra density is in the row length. The 40-position version BM23FR0.6-40DS-0.35V(895) is longer; pick the position count that matches your signal count exactly — there is no spare room for unused contacts at this pitch.
Stacking Height and Profile
The mated stacking height is 0.6mm, and the receptacle itself sits 0.024" (0.61mm) above the board.
It protects the mating surface for a limited number of insertion cycles, typical for a one-time assembly or infrequent field service. If the design requires repeated mating and unmating, a thicker gold spec would be needed; for a permanent board-to-board stack, this flash is adequate.