The Hirose BM23FR0.6-34DP-0.35V(895) is a 34-position header from the BM23 series, built for board-to-FPC interconnects where the z-height budget is tight. The mated stack height lands at 0.6mm, and the connector sits 0.50mm above the board surface — numbers that matter when you're stacking boards inside a phone or a wearable. Gold plating on the contacts (1.97µin) handles the repeated mating cycles these connectors see in consumer electronics — a phone's display cable gets mated once at assembly and stays put, so the flash plating is sufficient. The solder retention feature keeps the part from shifting during reflow, which is the main risk on a 0.35mm-pitch SMT part.
The 0.35mm pitch means the FPC must have matching 0.35mm pad spacing; a 0.5mm-pitch FPC won't align. Termination is SMT only — the solder retention tabs hold the part flat during reflow, and the 0.50mm height above board leaves clearance for the FPC to route under the connector body.