The Hirose BM23FR0.6-40DP-0.35V(895) is a 40-position header from the BM23 series, designed as a board-to-FPC interconnect with a 0.014" (0.35 mm) pitch. It uses outer shroud contacts that mate with the corresponding BM23 receptacle's inner contacts — a specific pairing, not a generic FPC clamp. The 0.020" (0.50 mm) height above board and 0.6 mm mated stacking height target ultra-thin mezzanine gaps in compact portable electronics, where every tenth of a millimeter of z-height matters. Gold-plated contacts with 1.97 µ" (0.050 µm) thickness handle the signal-level mating cycles typical of a smartphone or wearable display interconnect.
The 0.6 mm mated stack height defines the z-budget for the mezzanine gap: the PCB-to-FPC clearance after mating is just over half a millimeter, so the design must account for component keep-outs on both boards.