The Hirose BM23FR0.6-50DP-0.35V(895) is a 50-position header from the BM23 series, designed for board-to-board stacking in ultra-compact devices. It uses a 0.014" (0.35mm) pitch dual-row layout with outer shroud contacts, giving you 50 signal paths in a footprint that barely takes up board real estate. The mated stacking height is 0.6mm — that's about the thickness of two stacked business cards — so this is for applications where every micron of z-height matters: smartphones, wearables, compact camera modules, or any mezzanine stack where the gap between boards is razor-thin.
Stack Height and Pitch — The Z-Height and Density Trade-off
At 0.6mm mated stacking height, this connector is among the lowest-profile mezzanine headers available. That 0.6mm gap between boards means you can stack a secondary PCB directly over the main board with almost no air gap — useful for folding-phone hinges, miniaturised sensor arrays, or any design where the enclosure thickness is dictated by the connector stack. The 0.35mm pitch is tight enough that routing escape traces between pads requires a fine-line PCB capability — typically 0.1mm trace/space or better. If your board fab can't handle that, the BM23 series also offers a 0.4mm pitch variant, but for this part the 0.35mm pitch is fixed. Compared to the 40-position sibling BM23FR0.6-40DP-0.35V(895), this 50-position version gives you 10 more signal lines in the same footprint length — the extra positions are added along the row, not in a wider body.