Board-stacking selection: Hirose BM23 header, 6 positions, 0.35 mm pitch
The Hirose BM23FR0.6-6DP-0.35V(51) is a 6-position header with outer shroud contacts from the BM23 series, designed for board-to-board mezzanine stacking at a mated height of 0.6 mm. The 0.014" (0.35 mm) pitch and 0.020" (0.50 mm) height above board make it one of the lowest-profile interconnects in the series — suited for ultra-thin handheld devices, wearable electronics, and compact camera modules where every tenth of a millimeter of z-height is budgeted.
At 6 positions across 2 rows, this header matches the BOM line for a 6-circuit mezzanine interconnect.
The BM23FR0.6-6DP-0.35V(895) is a functional peer with the same pitch, stack height, and plating; it is not an official cross-reference but can serve as a drop-in alternative for the same 6-position footprint.