The Hirose BM23FR0.6-6DP-0.35V(895) is a 6-position header from the BM23 series, designed for board-to-board mezzanine connections where the mated stack height is just 0.6 mm. Gold plating on the contacts — 1.97 µin thick — gives this header the corrosion resistance and cycle life needed for repeated connect-disconnect in tight enclosures, typical of mobile devices, compact modules, and sensor boards.
Position Count and Pitch — Matching the BOM Line
With exactly 6 positions, this header matches a 6-circuit signal bundle without leftover pins.
Surface Mount Assembly with Solder Retention
This header is surface-mount only — no through-hole posts. The 0.50 mm height above board keeps the component profile low, critical when the mated stack is only 0.6 mm.