The Hirose BM23FR0.6-6DS-0.35V(895) is a 6-position receptacle with center strip contacts from the BM23 series, designed for board-to-board mezzanine stacking. It uses a 0.014" (0.35mm) pitch across two rows, with a mated stacking height of 0.6mm — one of the lowest profiles in the series. The connector sits just 0.024" (0.61mm) above the board surface, making it suited for ultra-thin portable electronics, wearable devices, and compact camera modules where every tenth of a millimeter of z-height is budgeted.
The 0.35mm pitch is the tightest parameter on this part — it drives the PCB footprint and routing density. At this pitch, the board layout engineer needs precise land pattern control and a solder mask defined pad to avoid shorts between adjacent contacts. The 0.6mm mated stacking height sets the rigid board spacing; there's no compliance in the connector itself, so the two PCBs must be parallel within a few hundredths of a millimeter. The connector's role is signal interconnect, not bus-level current.
The BM23FR0.6-8DS-0.35V(895) shares the same 0.35mm pitch, 0.6mm stacking height, gold plating, and solder retention features — the only difference is 8 positions instead of 6. If the BOM needs more I/O in the same footprint class, the 8-position version is a drop-in alternative on the same board-to-board interface. No change in board spacing or land pattern pitch; just two extra contact pairs.
It is ROHS3 compliant.