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Hirose Electric Co Ltd BM23FR0.6-8DS-0.35V(51) — Mezzanine & Stacking Connectors

Hirose BM23FR0.6-8DS-0.35V(51) Receptacle, 8 Pos

MPNBM23FR0.6-8DS-0.35V(51)
Active

Hirose BM23 series receptacle, center strip contacts, 8 positions, 2 rows, 0.014" (0.35mm) pitch, surface mount, gold contact finish, 0.024" (0.61mm) height above board, 0.6mm mated stacking height.

$0.7900Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
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Specifications

BM23FR0.6-8DS-0.35V(51) Technical Specifications
ParameterValue
SeriesBM23
MountingSurface Mount
Connector typeReceptacle, Center Strip Contacts
Height above board0.024\" (0.61mm)
Mated stacking heights0.6mm
Pitch0.014\" (0.35mm)
PackageTape & Reel (TR) Cut Tape (CT)
FeaturesSolder Retention
Contact finishGold
Rows2
Positions8
Contact finish thickness1.97µin (0.050µm)

Product details

Board-to-Board Interconnect for Ultra-Thin Stacking

The Hirose BM23FR0.6-8DS-0.35V(51) is an 8-position receptacle with center strip contacts from the BM23 series, designed for parallel board stacking at a fixed 0.6mm mated height. The 0.35mm pitch and 0.61mm height above board make it one of the slimmest mezzanine connectors available, suited for compact portable electronics where z-axis clearance is measured in tenths of a millimeter. Gold-plated contacts with 1.97µin thickness provide reliable signal connections in low-cycle applications typical of internal device interconnects.

What the 0.35mm Pitch and 0.6mm Stacking Height Mean for Your Layout

The 0.35mm pitch is the tightest dimension driving the PCB footprint — it demands fine-line routing between pads and limits the number of signal layers that can escape between contacts. The 0.6mm mated stacking height is the fixed z-axis clearance between the two boards; there is no height adjustment, so the mating board must have components no taller than this gap. The 0.61mm height above board on the receptacle side means the connector sits nearly flush, allowing the top board to sit directly over it without interference.

Solder Retention for Reflow Reliability

The BM23FR0.6-8DS-0.35V(51) includes solder retention features that hold the connector in place during the SMT reflow process. This eliminates the need for secondary adhesive or through-hole anchors, though the small footprint means the connector relies on the solder joints for mechanical strength once mounted. The surface mount termination and Tape & Reel packaging (available in Cut Tape as well) suit automated pick-and-place assembly.

The BM23FR0.6-8DS-0.35V(51) sits at 8 positions in a series that also includes 6-position (BM23FR0.6-6DS-0.35V(895)) and 10-position (BM23FR0.6-10DS-0.35V(895)) variants at the same 0.35mm pitch and 0.6mm stacking height. The choice between them is driven by signal count — the footprint and board keep-out zone scale with position count, so swapping between these requires a layout change.

Frequently asked questions

What is the stacking height of BM23FR0.6-8DS-0.35V(51)?

The mated stacking height is 0.6mm, with the receptacle sitting 0.024" (0.61mm) above the board surface. This is a fixed height — the mating plug must match this same 0.6mm stack to achieve proper contact alignment.

Where can I buy BM23FR0.6-8DS-0.35V(51) available via RFQ confirmation?

This part is sourced to order against your BOM quantity.