The Hirose BM23FR0.6-8DS-0.35V(895) is an 8-position receptacle from the BM23 series, designed for board-to-board stacking in space-constrained electronics. The 0.35mm pitch and 0.6mm mated stacking height target ultra-thin assemblies like smartphones, wearables, and compact IoT modules where every tenth of a millimeter matters. The 0.35mm pitch drives the PCB footprint — tight enough that routing between pads requires a controlled impedance stack-up on dense boards. The 0.6mm mated height is the only stacking option, so the mating male header must match exactly; there's no height adjustment range within this series.
The base product number BM23FR0.6 covers the series variant; the suffix (895) indicates the specific packaging and plating option. No official replacement or second-source cross-reference exists in the manufacturer's documentation.
The BM23FR0.6 family offers 6, 8, and 10 position variants at the same 0.35mm pitch and 0.6mm stacking height. The 8-position BM23FR0.6-8DS-0.35V(895) sits between the 6-position BM23FR0.6-6DS-0.35V(895) and the 10-position BM23FR0.6-10DS-0.35V(895).
The tape and reel packaging supports automated pick-and-place assembly.