The Hirose BM23FR0.8-18DP-0.35V(895) is an 18-position, dual-row header from the BM23 series, using a 0.014" (0.35mm) pitch. This is the tightest pitch in the BM23 family, so the PCB footprint must be laid out with fine trace widths and tight spacing — expect 0.18mm to 0.20mm trace/space on the inner layers to route out all 18 signals. The mated stacking height is 0.8mm, which sets the board-to-board gap in a mezzanine configuration; the 0.025" (0.63mm) height above board means the connector sits low, leaving clearance for components on the underside of the top board. Gold flash (1.97µin) on the contacts handles the few mating cycles typical of a production assembly — it is not specced for repeated field reconnects.
Hirose BM23FR0.8-18DP-0.35V(895) Header, 18 Pos
MPNBM23FR0.8-18DP-0.35V(895)
Active
Hirose BM23 series header, outer shroud contacts, 18 positions, 2 rows, 0.014" (0.35mm) pitch, surface mount, gold flash, 0.8mm mated stack height.
$1.2000Ref. price · indicative, final on quote
RoHSRoHS Compliant
SeriesBM23
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026
Specifications
| Parameter | Value |
|---|---|
| Series | BM23 |
| Mounting | Surface Mount |
| Connector type | Header, Outer Shroud Contacts |
| Height above board | 0.025\" (0.63mm) |
| Mated stacking heights | 0.8mm |
| Pitch | 0.014\" (0.35mm) |
| Package | Tape & Reel (TR) Cut Tape (CT) |
| Features | Solder Retention |
| Contact finish | Gold |
| Rows | 2 |
| Positions | 18 |
| Contact finish thickness | 1.97µin (0.050µm) |
Product details
Frequently asked questions
What is the pitch of BM23FR0.8-18DP-0.35V(895)?
The pitch is 0.014" (0.35mm), the tightest in the BM23 series, requiring fine-pitch PCB layout.
What is the mated stacking height for BM23FR0.8-18DP-0.35V(895)?
The mated stacking height is 0.8mm, which sets the board-to-board gap in a mezzanine configuration.