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Hirose Electric Co Ltd BM23FR0.8-18DS-0.35V(895) — Mezzanine & Stacking Connectors

Hirose BM23FR0.8-18DS-0.35V(895) Receptacle, 18 Pos

MPNBM23FR0.8-18DS-0.35V(895)
Active

Hirose BM23 series receptacle, center strip contacts, 18 positions, 2 rows, 0.014" (0.35mm) pitch, 0.031" (0.80mm) height above board, surface mount, gold contact finish.

$1.1700Ref. price · indicative, final on quote
StockIn Stock (15)
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

BM23FR0.8-18DS-0.35V(895) Technical Specifications
ParameterValue
SeriesBM23
MountingSurface Mount
Connector typeReceptacle, Center Strip Contacts
Height above board0.031\" (0.80mm)
Mated stacking heights0.8mm
Pitch0.014\" (0.35mm)
PackageTape & Reel (TR) Cut Tape (CT)
FeaturesSolder Retention
Contact finishGold
Rows2
Positions18
Contact finish thickness1.97µin (0.050µm)

Product details

0.35mm Pitch, 18-Position Mezzanine Receptacle

The Hirose BM23FR0.8-18DS-0.35V(895) is an 18-position receptacle with center strip contacts from the BM23 series, designed for board-to-board stacking at a mated height of 0.8mm.

18 Positions vs 10 — Same Footprint, Different Circuit Count

The 18-position BM23FR0.8-18DS-0.35V(895) shares the same 0.35mm pitch, 0.8mm mated height, and gold plating as the 10-position BM23FR0.8-10DS-0.35V(51). The difference is the circuit count — 18 positions against 10 — which changes the board footprint length. If your BOM calls for 18 signal lines, this is the direct match; the 10-position sibling won't cover the extra lanes without a second connector. The mating header is the BM23FR0.8-18DP-0.35V(895), same pitch and position count, outer shroud contacts — confirm both halves before committing the layout.

Solder Retention Pads Hold the Receptacle Through Reflow

The Solder Retention feature adds extra hold-down pads to the SMT footprint, keeping the receptacle aligned during reflow and resisting shear forces from cable strain or board flex after assembly. The Tape & Reel packaging (Cut Tape option available) feeds directly into a pick-and-place line; no hand-loading step.

Frequently asked questions

What is the pitch and mated height for BM23FR0.8-18DS-0.35V(895)?

The pitch is 0.014" (0.35mm) and the mated stacking height is 0.8mm. The height above board is 0.031" (0.80mm).