Board-Stacking Selection: Hirose BM23 Header at 0.35 mm Pitch
The Hirose BM23FR0.8-60DP-0.35V(895) is a 60-position header with outer shroud contacts from the BM23 series, designed for board-to-board mezzanine stacking at a mated height of 0.8 mm. The 0.014" (0.35 mm) pitch packs 60 circuits into a compact footprint, and the 0.025" (0.63 mm) height above board keeps the profile low for tight enclosures. Gold-plated contacts on both rows handle repeated mating in portable or modular gear where the board stack needs to separate for service.
Pitch and Routing Density
The 0.35 mm pitch is the centre-to-centre spacing between adjacent contacts in each row.
Mated Stacking Height and Z-Axis Fit
The 0.8 mm mated stacking height is measured from the top of the bottom PCB to the bottom of the top PCB when fully mated.
Position Count and BOM Matching
The BM23 series also offers 18- and 50-position headers at the same pitch.