The Hirose BM23FR0.8-60DS-0.35V(895) is a 60-position receptacle with center strip contacts from the BM23 series, designed for board-to-board mezzanine stacking at a 0.80mm mated height. The 0.35mm pitch packs 60 circuits into a dual-row footprint that suits dense parallel signal interfaces — think display links, camera modules, or main-to-subboard interconnects in compact handheld or portable equipment.
At 0.35mm pitch, this is a fine-pitch connector that demands a controlled impedance layout if used for high-speed signals — the trace escape from the BGA-like footprint needs necking down and via-in-pad may be required. The 0.80mm mated stack height is fixed by the receptacle height above board of 0.031" (0.80mm); the mating header (BM23FR0.8-60DP-0.35V(895)) sits at 0.63mm, so the total gap between PCBs is exactly 0.80mm. That is a tight z-budget — no room for stiffeners or component keep-outs on the inner faces.
The narrow pitch and thin plating limit current per circuit to signal levels.
No official direct replacement exists; the mating header is BM23FR0.8-60DP-0.35V(895) for the same 0.80mm stack height.