0.35mm Pitch, 0.8mm Stack — Ultra-Fine Mezzanine Header
The Hirose BM23PF0.8-10DP-0.35V(51) is a 10-position, 2-row header from the BM23 series, designed for board-to-board mezzanine stacking at a mated height of 0.8mm. Its defining feature is the 0.014" (0.35mm) pitch — one of the finer pitches available for a mezzanine interconnect — which, combined with the 0.025" (0.63mm) height above board, suits it for ultra-thin portable devices where every millimeter of z-height and board real estate is budgeted.
What the 0.35mm Pitch and 0.8mm Stack Height Mean for Your Design
At this density, routing a breakout from the outer rows requires careful fan-out; a 2-row, 10-position pattern keeps the footprint compact but leaves little room for via-in-pad without microvia capability.
The BM23PF0.8 series offers this same 0.35mm pitch, 0.8mm stack height, and gold finish in 10 and 14 positions. The BM23PF0.8-10DP-0.35V(51) is the 10-position variant; the BM23PF0.8-14DP-0.35V(51) carries 14 positions at the same pitch and stack height. The choice reduces to how many signals you need to route through the mezzanine interface — the footprint and board routing density scale with position count.