The Hirose BM23PF0.8-14DP-0.35V(51) is a 14-position header with outer shroud contacts from the BM23 series, designed for board-to-board mezzanine connections where vertical space is at a premium. It sits just 0.025" (0.63mm) above the board and mates to a complementary receptacle at a 0.8mm stack height — a common gap for stacking parallel PCBs in compact handheld or portable devices. The 0.014" (0.35mm) pitch on two rows packs 14 circuits into a narrow footprint, matching the pad pitch of fine-pitch FPCs or rigid boards in the same assembly. Surface-mount termination with no through-holes keeps the opposite board side clear for additional components.
Hirose BM23PF0.8-14DP-0.35V(51) Header, 14 Pos, 0.35mm Pitch
MPNBM23PF0.8-14DP-0.35V(51)
Active
Hirose BM23 series header, outer shroud contacts, 14 positions, 2 rows, 0.014" (0.35mm) pitch, surface mount, gold contact finish, 0.025" (0.63mm) above board, 0.8mm mated stacking height, solder retention feature.
$1.0500Ref. price · indicative, final on quote
RoHSRoHS Compliant
SeriesBM23
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — typically 7–15 days door-to-door
Independent China distributor & sourcing agent· Listing updated Aug 2026
Specifications
| Parameter | Value |
|---|---|
| Series | BM23 |
| Mounting | Surface Mount |
| Connector type | Header, Outer Shroud Contacts |
| Height above board | 0.025\" (0.63mm) |
| Mated stacking heights | 0.8mm |
| Pitch | 0.014\" (0.35mm) |
| Package | Tape & Reel (TR) Cut Tape (CT) |
| Features | Solder Retention |
| Contact finish | Gold |
| Rows | 2 |
| Positions | 14 |
| Contact finish thickness | 1.97µin (0.050µm) |
Product details
Frequently asked questions
What is the pitch of the BM23PF0.8-14DP-0.35V(51)?
The pitch is 0.014" (0.35mm), which is the fine-pitch spacing used in the BM23 series for compact board-to-board stacking.